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  1. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
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    www.dodgedemonclub.com - 2009-04-03

  2. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
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    multi-chip1
    MBGA1
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    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

chip scale package1 land grid array1 csp1 advanced packaging1 bga1 for sale4 pcb2 assembly2 ball grid array1 abr2

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